In light of this, I'm sharing a card which was published in the July 2014 issue of Paper Crafts & Scrapbooking using structure paste. I really enjoyed this submission category and look forward to making more cards using "texture" "dimension" and "techniques" over at MMCC.
Texture? Yep. Structure paste through a dots stencil and through the "hello" negative die cut. Dimension? Yep. Wire and beads. Techniques? Yep. DIY stamps from craft foam and dies.
Thanks for looking! And watch for more "cassy" creations from me = CAS + messy fingers, BTW ;)
And while I've got your attention... there's a STAMPlorations July release/birthday blog hop coming up on June 26 with lotsa prizes ;)
Supplies golden hello:
Paper: CS Bringmann
Ink : Clearsnap
Tools: die PTI, stencil TCW
Other: structure paste, wire, beads, craft foam